Toxicology
Toxicology Summary
Acids
Acetic acid
Aqua regia
Buffered oxide etchant BOE 1235
Chemical polish CP4
Hydrochloric acid
Hydrofluoric acid
Metal etch
Nitric acid
Phosphoric acid
Phosphorus oxychloride
95% poly: etch
Sulfuric acid
Bases
Ammonium hydroxide
Potassium hydroxide and Sodium
hydroxide
Resist remover 1112A
Shipley AZ-351 developer
Solvents
Acetone
Benzene
Chlorobenzene
Ethylene Diamine
Ethylene Glycol
Formaldehyde
Kodak microresist developer
Kodak microresist rinse-n butyl
acetate
Kodak microresist thinner - methyl
"cellosdre" acetate
Methyl Alcohol
Methylethyl ketone
N-methyl - 2 pyrrolidone
N-propyl alcohol
Toluene
Trichloroethylene (TCE)
Xylene
Gases
Borontrifluoride
Freon 114
Oxygen
Ozone
Phosphorus pentafluoride
Others
Ammonium chloride
Ammonium fluoride
AZ thinner
Beryllium
Boron nitride wafer
Hydrazine
Hydrogen peroxide
Phosphorous source wafer
Polyimide
Potassium dichromate
Pyrocatechol
Spin on dopants (boron and phosphorus)
Summary of Most Common Acid Bases and
Solvents
Potentially hazardous chemical reactions in the fume
hood
Clean up of chemical spills
Fires and extinguishers
Plasma asher/etcher
Ion implanter
Lasers/model 42 industrial C02 laser
X-Rays
Ultraviolet radiation
Last modified: Wed Aug 27 14:03:14 EDT