Suss CL200 MegaSonic Wafer Cleaner
Description:
The SUSS CL200 Cleaner/SOI Bonder is designed to perform four process steps
- cleaning, drying, alignment, and bonding - in a single, closed chamber.It
is specifically designed for use in the manufacture of Silicon-On-Insulator
(SOI) substrates, where the bond-surface cleanliness is of the utmost importance.
Two wafers are processed simultaneously in the closed chamber, thus insuring
that the cleaned surfaces are kept free of contaminants from external sourecs.
The prebond carried out in the system makes it impossible for the contamination
to occur on the bond interface prior to the annealing step of the process.
Minimised wafer contamination significantly reduces bond defects and increases
yield. Allignment is done by causing the wafers to float on a nitrogen cushion
(purge system) and allowing them to float to reference pins at the flat or
notch at the edges. The prebond is then initialized either at the edge (standard)
or center (option).
Features:
- Wafer and Substrate sizes from 100mm/4" up to 200mm/8"
- High Yield using the local clean room concept and a closed process chamber design
- Bonding in controlled environment free from contamination from external sources
- Flexible process control using Windows NT with data recording and analysis
- Full repeatability of processes run on the CL200
Cost: $180,000