U of L MicroFab
Standard Operating Procedures

• Gowning Procedures and Cleanroom Access Protocol
• Cleanroom Startup and Shutdown
• MET One Laser Particle counter
• Wafer Cleaving
• pH Meter

• Initial Wafer Clean
• Wet Oxidation Using the 2" Furnace
• General Oxidation Using the 4" Furnace
• Programming the Blue-M Furnace Controller
• DCE Oxidation

• Vaccum Dehydration Bake
• Photomask Cleaning
• Soft Bake
• Hard Bake
• Positive Resist Development
• OCG HNR 120 Resist Development
• Kasper 2001 Mask Aligner
• Spinning using the P-6000
• Spinning using the SOLITEC 5100
• Vacuum Bake with (YES) Vacuum Oven
• Vapor Prime with (YES) Vacuum Oven

• Silicon Dioxide Etching
• Aluminum Etching
• Gold Etching
• Reactive Ion Etching
• Strip Positive Resist (Microposit S1800 and S1600 series)
• Strip Negative Resist (OCG SC and HNR series)
• Lift-off Patterning

• Evaporation (Denton Evaporator)
• Diffusion Pump Oil
• Sputtering E5100 Advanced Sputterer
• Sputtering using Technics 4604 Sputterer
• Anneal Aluminum on SiO2 Substrate
• Anneal Aluminum on Si Substrate

• ZEISS Axioskop Microscope
• ZEISS Axiotron Inspection Microscope
• Taking Pictures Using the Camera on the Zeiss Axioskop Microscope
• Leitz ERGOLUX Microscope
• Four Point Resistivity Measurement
• Profilometer
• Post-Etch Inspection
• Digital Micrometer
• Filmetrics Thin Film Measurement System

SECTION 7.  PACKAGING

• Flip Chip Bonding

SECTION 8.   OTHER EQUIPMENT

• Vacuum Ovens
• Gas Regulators
• Micro Automation Programmable Dicing Saw (including Optical Alignment and Programming)
• Diamond Saw Blade Changing
• Lapmaster Machine, Terminology and Nomenclature page
• Lapmaster Machine, How to Check and Change the Lapping Plate Flatness
• Lapmaster Machine, Lapping or Polishing Process Setup and Operation

• Low-Resolution Mask Making
• Printed Circuit Board Fabrication