Sop #11

Title: Vacuum Dehydration Bake

Purpose: To prepare the surface of the wafer for photoresist application. This operation promotes adhesion of the photoresist by evaporating any moisture present on the surface of the wafer. NOTE: A dehydration bake is especially important when delays between substrate preparation (growing oxide, evaporating layers, sputtering layers etc.) and resist application occur. Preparation and Precautions: 1. Oven #1 is dedicated to the dehydration bake. Temperature in this oven should read 200° C± 5° C. 2. In case the oven door has been left open prior to use, follow the appropriate procedure and allow temperature to stabilize before baking wafers. IMPORTANT: If another temperature setting is desired, refer to the Blue-M Vacuum Oven SOP. Procedure With Vacuum: 1. The oven will be under vacuum. To open the door of the oven, shut off VACUUM valve to isolate the oven from the vacuum source. Open VENT valve to bleed air into the oven. Open the oven door when the oven is under the atmospheric pressure. 2. Place wafer face up on one of the shelves in the oven. 3. To put oven under vacuum: close the door. Close VENT valve to isolate oven from the atmosphere. Turn on the vacuum pump. Open VACUUM valve. The vacuum should start building up as manifested on the vacuum gauge. 4. Let the vacuum build up to about 15 inch Hg. Close VACUUM valve, isolating the oven. 5. Bake the wafers for a minimum of 30 minutes. 6. At the end of the bake, release vacuum and open the oven door as step 1.Remove wafers with help of tweezers. Close the oven as steps 3 and 4. Procedure Without Vacuum: 1. The oven will be under vacuum. Open the oven door when the oven is under the atmospheric pressure. 2. Place wafer face up on one of the shelves in the oven. 3. Close oven door 4. Bake the wafers for a minimum of 30 minutes. 5. At the end of the bake, remove wafers with help of tweezers. Close the oven and proceed to the next process or store the wafers in a clean wafer holder.
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